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2026/03 停產商品

VT-S530

PCB Inspection System

VT-S530

Omron's 3D-SJI (Solder Joint Inspection) Ensuring High-quality Products in an Efficient Manufacturing Environment

此頁記載內容是在依據停產前商品型錄內刊載的資訊,包括商品的特點 /價格 /對應規格 /選購品等,可能會和現狀有所出入。請在選購前再次確認系統的適用性及安全性。

Omron's 3D-SJI (Solder Joint Inspection)

Materializes quantitative inspection of solder joint and implementation, while minimizing risks of overlooking unknown defects by the quality product criteria inspection based on the standards, contributing to vertical startup of inspection.

VT-S530 特長 1

Example Defects

VT-S530 特長 2

Whole PCB surface inspection

Detecting foreign objects accurately is achieved through combining 3D (height) and 2D (area) measurements on the entire PCB surface. (Lands without solder can be excluded from the inspection)

VT-S530 特長 3

High productivity inspection

High production throughput supported through dual lane.
Dual lane operation using various PCBs is possible, due to its handling capability up to the PCB size of 510 (W) x 330 (D) mm.

VT-S530 特長 4