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VT-S530

PCB Inspection System

VT-S530

Omron's 3D-SJI (Solder Joint Inspection) Ensuring High-quality Products in an Efficient Manufacturing Environment

相關資訊

更新日期 2019年4月15日

Hardware configuration

Dimensions 1180(W)×1640 (D)×1500(H) mm
Weight Approx. 850kg
Power supply Voltage 200 - 240VAC (single phase),
voltage fluctuation range ±10%
Normal rated power 2.0kVA
Line height 900±20mm
Air supply pressure 0.3 - 0.6MPa
Operating temperature range 10 - 35°C
Operating humidity range 35 - 80%RH (Non-condensing)
Image signal
input block		 Imaging system 12M pixel camera
Inspection principle 3D reconstruction through color highlight and phase shift technology
Image resolution 10μm/15μm
FOV 10μ: 40×30mm
15μ: 60×45mm

Functional specifications

Supported PCB size (min.) 50(W)×50(D)mm
Supported PCB size (max.) Dual lane: 510(W)×330(D)mm
Single lane: 510(W)×680(D)mm
Clearance Above: 50mm; Below: 50mm
Height measurement range 25mm
Thickness 0.4 - 4mm
Inspection item Component height, lift, tilt, missing/wrong
component, wrong polarity, flipped component,
OCR inspection, 2D code, component offset
(X/Y/rotation), fillet (height/length, end joint
width, wetting angle, side joint length), exposed
land, foreign material, land error, lead offset,
lead posture, lead presence, solder ball, solder bridge

更新日期 2019年4月15日

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