Taiwan
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規格選型
| Item | Description | |||
|---|---|---|---|---|
| Model | VT-X750 | VT-X750-XL | ||
| Type | H-FR | FR | H-FR | |
| Inspection object | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side
terminal components, QFN, Power devices, POP, Press-fit CN, etc. |
|||
| Inspection items | Void, open, non-wet, Solder Volume, shifting, foreign object, bridging,
Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications) |
|||
| Imaging
system |
Method | 3D-slice imaging by using parallel CT | ||
| Resolution | 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
3, 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
10,15,20,25,30µm/pixel
(selectable in the inspection program) |
|
| X-ray source | Micro-fucus closed tube | |||
| X-ray detector | Flat panel detector | |||
| PCBA | Size | 50x50～610x515mm (2x2 to 24x20 inch),
Thickness：0.4～5.0mm (0.4～3.0mm in 3µm resolution) |
100x50～1200x610mm,
Thickness：0.4～15.0mm |
|
| Weight | Less than 4.0 kg (with component mounted) | Less than 15kg | ||
| Component
clearance |
Top:Less than 40 mm,
Bottom:less than 39 mm |
Top: Less than 40 mm,
Bottom: Less than 40 mm |
||
| Warpage | Less than 2.0 mm
(Less than 1.0ｍｍ in 3µm resolution) |
Less than 3.0 mm | ||
| Main
body |
Footprint | 1,550(W) x 1,925(D) x 1,645(H) mm | 2,180(W)×2,510(D)×1,735(H)mm | |
| Weight | Approx. 3,100kg | Approx. 5,350kg | ||
| Conveyor
height |
900 ±20 mm | |||
| Power supply | Single phase, 200 to 240 VAC, 50/60 Hz | |||
| Rated power | 2.4kVA | 2.58kVA | ||
| X-ray leakage | Less than 0.5 µSv/h | |||
| Air supply | 0.4 to 0.6 Mpa | |||
| Safety
standard |
CE, SEMI, NFPA, FDA | CE, SEMI, NFPA, FDA
*Under Acquiring |
||
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