Item | Description | |||
---|---|---|---|---|
Model | VT-X750 | VT-X750-XL | ||
Type | H-FR | FR | H-FR | |
Inspection object | BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side
terminal components, QFN, Power devices, POP, Press-fit CN, etc. |
|||
Inspection items | Void, open, non-wet, Solder Volume, shifting, foreign object, bridging,
Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications) |
|||
Imaging
system |
Method | 3D-slice imaging by using parallel CT | ||
Resolution | 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
3, 6,8,10,15,20,25,30µm/pixel
(selectable in the inspection program) |
10,15,20,25,30µm/pixel
(selectable in the inspection program) |
|
X-ray source | Micro-fucus closed tube | |||
X-ray detector | Flat panel detector | |||
PCBA | Size | 50x50~610x515mm (2x2 to 24x20 inch),
Thickness:0.4~5.0mm (0.4~3.0mm in 3µm resolution) |
100x50~1200x610mm,
Thickness:0.4~15.0mm |
|
Weight | Less than 4.0 kg (with component mounted) | Less than 15kg | ||
Component
clearance |
Top:Less than 40 mm,
Bottom:less than 39 mm |
Top: Less than 40 mm,
Bottom: Less than 40 mm |
||
Warpage | Less than 2.0 mm
(Less than 1.0mm in 3µm resolution) |
Less than 3.0 mm | ||
Main
body |
Footprint | 1,550(W) x 1,925(D) x 1,645(H) mm | 2,180(W)×2,510(D)×1,735(H)mm | |
Weight | Approx. 3,100kg | Approx. 5,350kg | ||
Conveyor
height |
900 ±20 mm | |||
Power supply | Single phase, 200 to 240 VAC, 50/60 Hz | |||
Rated power | 2.4kVA | 2.58kVA | ||
X-ray leakage | Less than 0.5 µSv/h | |||
Air supply | 0.4 to 0.6 Mpa | |||
Safety
standard |
CE, SEMI, NFPA, FDA | CE, SEMI, NFPA, FDA
*Under Acquiring |