• Downsizing package
• Higher density with stacked layer
• Variety of device combination (SiP)
High speed automated X-ray CT inspection system For SEMICONDUCTOR
更新日期 2015年3月2日
• Downsizing package
• Higher density with stacked layer
• Variety of device combination (SiP)
Omron’s proven 3D-CT technology leads through
- Fast and Quantitative metrology
- Stable Imaging with Sub-Micron Magnification
- Recipe-based Automated Inspection
更新日期 2015年3月2日